The copper clad plate surface is chemically etched unwanted copper conductors to form a line pattern.
Process:
Input→Precision-Etching→ Rinse→WR/S(1)(2)(3)→Fresh WR/S→Output
Specification
Outerdimensions 6024*2227*2700mm±25mm |
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Panelsize: |
250*250 mm[Min] | |||
Platethickness: |
05() | |||
Conveyorspeed 0.5~m/minAdjustable |
911 mm±25mm |
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Conveyorwidth760 mm |
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3Phase 50HZ36KW |