Type: four-layer
PCB Number of layers: double-sided and
multi-layered (up to *8 layers) With blue,green ang black
solder mask Materials: Fr4Tg ≥**0°C'
Surface finishes: lead free HAL, HAL, flash gold, immersion gold,
immersion tin, immersion silver, OSP, Goldfinger plating, carbon
ink printing, and peelable blue mask (peters 2,**4) Cooper
thikness: 4oz above Board thickness: 1.6mm
M inimum hole size: 0.*5mm is available
Mininum line width: 0.1mm Minimun line spacing:
0.1mmTechnology: blind
via, buried via, selective plating, and micro via (laser
drill) Surface: high temperature tolerance OSP
(Cu***6A HT (x)) Used for telecommunication products
ISO *****-,TS ****9:****- and UL- certified. All the products
have reatched the standards of IPC, ROHS.
