Item specifics
Package:BGA
Pitch:0.5mm
Pin Count:**1
IC Size:*1.5X*3mm
Structure:Clamshell
Contact:Spring Probe
Product Description
BGA**3 Socket USB Solution_ Pitch 0.5mm _ *1.5x*3mm
,High-speed Read & Write Solution,eMMC Test, IC Socket
***********-Open***********-Without lid***********-Close
Write and Read test speed up to **0.9MB/S(Test chip
brand:Samsung, Part Number:KLMB*4GEND)
QQ*************3
Feature
Suitable for devices of Samsung, Hynix, Toshiba,
Intel, Kingston etc eMMC and eMCP.
Support eMMC version: ≤eMMC5.0.
Support hot plug, eMMC can be directly connected to PC with
USB port.
Realize reading, accessing and writting data for eMMC and
eMCP devices
Specification
Meterial
Socket Body:PPS
Socket Lid:Aluminum Alloy
Mechanical
Contact types:Pogo Pin
Spring Force:*4.5gf 0.*5mm Travel
Operation Temperature: 0ºC to *0ºC
Lift Span of operating travel:*0K Cycles Min
Electrical
Current Rationg(Continuous):2A
DC Resistance:**0mohm 0.*5mm
