LPM-1 micro laser cluster perforation or other material treatment
at wide web, large area, surface or whole material cluster
treatment, cutting, welding, drilling, ablation, cleaning, melding,
high power dual rotation laser beam splitter, twin multiplexer
level. Operates with quadruple Co2 carbon or other laser beam
s up to 4 Kilowatt to a high power twin vacuum level
multiplexer to generate up to 200 individual laser output channels
and perforation rows cross web, combines automatic positioned laser
perforation heads, focus setting. Web speeds up to 400 m/min, web
widths up to 2, 000mm, up to 2, 500, 000 holes per second, jumbo
roll-by-roll production, optical online permeability as perforation
line position control, porosity feedback, hi-tech automation level
and other features. Each laser micro perforation lines can achieve
100-1, 000 C.U. Material treatment and robotic handling for
stainless steel, ceramic, aluminum, wafer, gold, glass, silver,
brass, copper, wafer, silicon, titanium, diamonds, jewelry,
silicon, solar, panel, photovoltaic, micromachining, slitting,
rewinding, refining machines or stand along systems. Patent granted
DE102004001327. Industry fields. The conception of high power twin
level laser beam multiplexer enables hundred options in other
industry application fields as cutting, cut-off, welding, surface
finishing, high-speed drilling, ablation, cleaning, micromachining,
polishing, forming, melting, surface treatment, roughness
improvement. Each up to 200 single laser heads is coupled via
flexible hollow fibers allows treatment processes or micro
perforation heads easy to position in X across and in Y direction
of running web or static placed sheet material. The automatic
processes, equipments and devices open now outstanding
possibilities in industry, metal, plastic, domestic, tobacco
product, medical, hygienic, wall covering, security cards, bank
notes or food application.