LPM-1 micro laser cluster perforation or other material treatment at wide web, large area, surface or whole material cluster treatment, cutting, welding, drilling, ablation, cleaning, melding, high power dual rotation laser beam splitter, twin multiplexer level. Operates with quadruple Co2 carbon or other laser beam s up to 4 Kilowatt to a high power twin vacuum level multiplexer to generate up to 200 individual laser output channels and perforation rows cross web, combines automatic positioned laser perforation heads, focus setting. Web speeds up to 400 m/min, web widths up to 2, 000mm, up to 2, 500, 000 holes per second, jumbo roll-by-roll production, optical online permeability as perforation line position control, porosity feedback, hi-tech automation level and other features. Each laser micro perforation lines can achieve 100-1, 000 C.U. Material treatment and robotic handling for stainless steel, ceramic, aluminum, wafer, gold, glass, silver, brass, copper, wafer, silicon, titanium, diamonds, jewelry, silicon, solar, panel, photovoltaic, micromachining, slitting, rewinding, refining machines or stand along systems. Patent granted DE102004001327. Industry fields. The conception of high power twin level laser beam multiplexer enables hundred options in other industry application fields as cutting, cut-off, welding, surface finishing, high-speed drilling, ablation, cleaning, micromachining, polishing, forming, melting, surface treatment, roughness improvement. Each up to 200 single laser heads is coupled via flexible hollow fibers allows treatment processes or micro perforation heads easy to position in X across and in Y direction of running web or static placed sheet material. The automatic processes, equipments and devices open now outstanding possibilities in industry, metal, plastic, domestic, tobacco product, medical, hygienic, wall covering, security cards, bank notes or food application.