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donghuan,Shenzhen,Guangdong,China China
联系人 liu hang
办公地址 donghuan, Shenzhen, Guangdong
LED sealant LCD Adhesive SMT Adhesive LED Underfilled Adhesive UV Adhesive Special Instant dry Adhesive
used in light-emitting diodes ( LED ) package high refractive index high light transmittance increase th
UV Adhesive for P+R low white environmental protection fast curing speed good maneuverability high effici
super glue 496B Almost suitable for all kinds of meterial room temperature curing fast curing for hard bon
High strength low viscosity for the M36 following thread locking sealing the permanent prevent the screw
adhesive SMT Adhesive bonding electronic components low viscosity high flexibility low temperature curing
High temperature resistant High viscosity instant seal resistant to high temperature excellent solvent res
special for TPU+P lower odor nvironmental protection fast curing speed good maneuverability high efficie
especially for P+R low white one-component bonding material widely insensitive surface type fast curing
SMD Adhesive high and low power LED LED Chips patching high refractive index high light transmittance go
Treatment of 980 The 980 treating agent technical performance Product Code: 980 treatment agent Packaging
Underfill Adhesive BGA Glue filling of Mobile Phoneâs main board filling of Computerâs main
especially for P+R This product is a cyanoacrylate low white low odor one-component fast curing
Our company's solid crystal glue has high conductivity and high thermal conductivity characteristics,
special for P+R lower odor environmental protection fast curing speed good maneuverability high efficienc
Rapid solidification suitable for bonding metal and glass with accelerator LB7649 high intensity multipurpo
special for TPU+P lower odor environmental protection fast curing speed good maneuverability high effici
In 1, the main agent and hardening agent ratio 1: 1 ( volume ratio ) , when using , totally mixed, coated on t
underfilling adhesive flip chips one component Mainly for filling and protection after the CSP;BGA and UBGA
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