Type: four-layer PCB
Number of layers: double-sided and multi-layered (up to *8 layers)
With blue,green ang black solder mask
Materials: Fr4Tg ≥**0°C'
Surface finishes: lead free HAL, HAL, flash gold, immersion gold,
immersion tin, immersion silver, OSP, Goldfinger plating, carbon
ink printing, and peelable blue mask (peters 2,**4)
Cooper thikness: 4oz above
Board thickness: 1.6mm
Minimum hole size: 0.*5mm is available
Mininum line width: 0.1mm
Minimun line spacing: 0.1mm
Technology: blind via, buried via, selective plating, and micro via
(laser drill)
Surface: high temperature tolerance OSP
