Excellent Intelligent Technique 9M10 Embedded Processor Board

详情

 AT*1SAM9M*0 Embedded Core Board Specifications

Core Module is designed by *-floor PCB; the volume is only card size(*4**3mm); together with CPU, **8M DDR2 RAM,**8M Nand Flash, **2K DataFLash, *0/**0Mbps; using 5V dc power supply, low power consumption and high performance power management function, to achieve the necessary CPU core voltage conversion; Industry standard design, through the high temperature resistant B to B (2***0) connector leads to a variety of commonly used interface resources, in order to offer fast and the secondary development of use for those who do not intend to design the CPU plate themselves, and it’s suitable for the batch used by the user.

Chip introduction

 AT*1SAM9M*0 chip, the combination of the functional interface and high speed data connection, including LCD controller, resistive touch screen, the camera interface, audio, *0/**0 M Ethernet, high-speed USB and SDIO, etc. As the processor running at **0 MHZ and multiple rates more than **0 MBPS peripherals, it use high performance and bandwidth network or local storage media to provide a good user experience.

     AT*1SAM9M*0 support the latest DDR2 and interface of NAND flash memory to store programs and data. The multi bus interface is associated with one of the *7 DMA channel **3M, and a pair of external bus interface, and can be used to configure a tightly coupled memory (TCM) distributed memory of *4K bytes, they required for maintaining high speed peripheral processor and communication bandwidth. AT*1SAM9M*0 power management controller has high efficient clock gating; when on power and standby mode, the power consumption of battery backup can be reduced to the a minimum.

     With years of operational experience in embedded applications, we fully consider the actual performance of main board, and the overall design conforms to the requirements of the industrial field environment. It can be used as development, learning to use, also can be directly applied in industrial field, to provide the most convenient for you.
 

FLASH Storage
•On-board **2K DataFlash(DB****1D)
•On-board **8M*8bits NandFlash (K9F1G*8U0B) could change a large capacity or industrial chip according to customer\'s requirement

Interfaces
• 2***0 pin 0.8mm spacing B to B(the connectors are **0°C high temperature-tested and seismic-tested)

Other Resources
• DM***1 net chip, support *0M/**0M self-adaptive Ethernet with MII mode, more compatible than RMII;
• 1.8V, 3.3V, 5.0V voltage input

PCB Specification & Size
• Using *-layers of PCB high precision process, and has the best electrical properties and anti-jamming performance
• *4 x *3 x 1.5mm

Working Parameters
• Working temperature: **0°C~ *0°C (batch user could customize **0°C~ *5°C)
• Humidity Range: 5%~ *5%, Non-Condensing

Low Power Consumption
• 5V Dc power supply, low power consumption, <1W

Support OS
• Linux2.6.*0 + QT2.3 / QT4
• WindowsCE 6.0