Customized W85Cu Tungsten Copper Alloy Electronic Packaging Mounting Base Plate

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Product Description:
It is a composite of tungsten and copper. The coefficient of thermal expansion (CTE) of the composite can be disigned by controlling the content of tungsten, matching that of the materials, such as Ceramics (Al2O3, BeO),Semiconductors (Si),Metals (Kovar), etc. The products are widely applicated in the fields such as radio frequency,microwave,high power diode packaging and optical communication system.

Features:
a.High thermal conductivity;
b.Excellent hermeticity;
c.Excellent size control,surface finish and flatness Semi-finished or finished (Ni/Au plated) products available;

Product information: