Copper Molybdenum Copper Encapsulation Materials, electronic packing materials

详情

Copper molybdenum copper encapsulation materials,electronic packing materials                                                                                                                            Product Description:
It is a composite made from Mo and Cu. Similar to W-Cu, CTE of Mo-Cu can also be tailored by adjusting the composition. But Mo-Cu is much lighter than W-Cu, so that it is more suitable for aeronautic and astronautic applications.

​Features:
High thermal conductivity due to no sintering additives were used
Excellent hermeticity
Relatively small density
Stampable sheets available (Mo content not more than *5wt.%)
Semi-finished or finished (Ni/Au plated) parts available

Product information: