联系人 joe
Shenzhen, Guangdong
| Category | Capability | |
| 1 | Layers | **2Layer |
| 2 | Material Supplier | Bergquist,Laird,Sanyo,Polytronics,TOTKING,DENKA,NRK ITEQ,BOYU |
| 3 | Metal base type | FR*4, Al base board, CU base board |
| 4 | Aluminum models | ***0,***3,***2,***1 |
| 5 | Board Thickness | 0.**3.2mm |
| 6 | Insulation layer thickness | *****0um |
| 7 | Max Board Size | ***0×**0mm |
| 8 | Heat conductivity | 1W/Mk, 2W/Mk, 3W/Mk, 4W/Mk, 8W/Mk |
| 9 |
Electric Strength |
DC:**0V/*0uA or ***0V/5mA(LED) |
| According to the material properties | AC:***0V/1Ma or ***0V/5mA(POWER) | |
| *0 | Core material thickness | Min:0.1mm |
| *1 | Inner line width/Space | 0.1/0.1mm |
| *2 | Outer line width/Space | 0.*5/0.*5mm |
| *3 | Layer to Layer Registration | ±0.*5mm |
| *4 | Copper foil thickness | HOZ,1OZ,2OZ |
| *5 | Finished hole diameter | 0.*5mm |
| *6 | Hole diameter tolerance | ±0.*5mm |
| *7 | Hole position tolerance | ±0.**5mm |
| *8 | Surface finish |
HASL,HASL pb free,immersion gold,immersion silver,immersion tin, O.S.P (Entek),S/G plating,ENEPIG,G/F plating,carbon… |
| *9 | Profiling | Punching, Routing, V-CUT, Beveling |
| *0 | Special requirements | Buried and blind vias ,controlled impedance ,BGA |
| *1 | minimum V-CUT Board Thickness |
0.6mm |
| *2 |
maximum Test Insulation Resistance |
**0MΩ |
| *3 |
minimum Test Conductive Resistance |
*0 Ω |
| *4 |
Plate shape tolerance |
±0.*0mm(4mil) |
| 国家: | China |
| 型号: | - |
| 离岸价格: | 获取最新报价 |
| 位置: | - |
| 最小订单价格: | - |
| 最小订单: | - |
| 包装细节: | - |
| 交货时间: | - |
| 供应能力: | - |
| 付款方式: | - |
| 產品組 : | - |
