Amaoe IP*6 A*8 BGA Reballing Stencil for iPhone *6/*6 Plus/*6
Pro/*6 Pro Max motherboard CPU/font/audio/power IC /USB control
IC and iPhone *6 middle layer soldering repairs. High quality
BGA reballing stencil comprehensive steel mesh for iPhone *6/*6
Pro Max middle layer frame/motherboard chip
soldering.
Option:
1. Amaoe IP*6 A*8 Reballing Stencil (test version):
comprehensive reballing stencil for iPhone *6/*6 Plus/*6
Pro/*6 Pro Max.
2. Amaoe IP*6 PL***2 reballing stencil (test version): for
iPhone *6/*6 Plus middle layer frame soldering.
3. Amaoe IP*6 reballing stencil (test version): for iPhone *6
Pro/*6 Pro Max middle layer frame soldering.
Please note that the iPhone *6 series reballing stencil is
currently only a test version and will be modified based on
the actual motherboard situation.
