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Diamond Cutting Wire for Silicon Wafering
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Diamond Cutting Wire for Silicon Wafering

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国家:

China

型号:

0.12mm--0.4mm

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位置:

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付款方式:

T/T

產品組 :

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联系人 Lisa

806# Building 1 Area A, AVICCITY International City, XingJin Road XingLin Wan, Xiamen, Fujian

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Diamond Wire is effectively used for a variety of cutting applications: wafering, cropping, blocking, and squaring. The many benefits of cutting with diamond wire include: 2 - 3 times the throughput, lower cost of ownership, increased production, lower kerf, and equivalent wafer quality. Existing slurry saws can easily be converted to diamond wire to take advantage of the many benefits.

国家: China
型号: 0.12mm--0.4mm
离岸价格: 获取最新报价
位置: -
最小订单价格: -
最小订单: -
包装细节: -
交货时间: -
供应能力: -
付款方式: T/T
產品組 : -

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Lisa < XIAMEN LIVIYA CO.LTD >

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