Standard FPC from Multek is utilized extensively in a wide variety
of electronic assemblies from simple antennas to complex control
circuitry. Standard FPC includes single and double layer flexible
circuits built on adhesive based polyester (“PET” / “PEN”) or
polyimide (PI) film substrates with copper thicknesses ranging from
*8um to **0um. These circuits can be provided in single pieces,
multiple up arrays, or in rolls.
Key Capabilities:
Single or double-sided circuitry
Adhesive-based and adhesiveless constructions
PET, PEN or PI film substrates
Low-cost, roll-to-roll manufacturing
Screen print imaging with minimum conductor pitch at 0.*0mm
Photo imaging with minimum conductor pitch at 0.*5mm
Screened inks, photo imageable soldermasks, or laminated coverfilm
dielectrics
Surface finishes include anti-tarnish. immersion silver, tin,
solder, electroplated nickel/gold and ENIG
Various support materials can be selectively added including: metal
heatsinks, film stiffeners,
FR4/CEM1/G*0 rigidizers, molded plastic assemblies, and EMI
shielding
| 国家: | China |
| 型号: | - |
| 离岸价格: | 获取最新报价 |
| 位置: | - |
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| 最小订单: | - |
| 包装细节: | - |
| 交货时间: | - |
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| 付款方式: | - |
| 產品組 : | - |
