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| Layer Count & Material | |||
| Layers | **8Layers | Maximum Panel Size | *9.6**1.0 inch |
| Maximum Single Unit Size | 9inch**4inch （limitation is 9inch**3inch） | Minimum Panel Size | 9.0**2.0 inch |
| Board Size Tolerance | ±0.1mm | Maximum Finished Board Thickness | 0.*0mm |
| Minimum Finished Board Thickness | 0.*5mm | ||
| Trace/Line | |||
| Minimum Line Width for Inner Layers | 3mil | Minimum Line Spacing for Outer Layers | 3.5mil |
| Minimum Line Width for Outer Layers | 3mil | The Copper Thickness for Inner Layers | ≤2OZ |
| Minimum Line Spacing for Inner | 3mil | The Copper Thickness for Outer Layers | ≤3OZ |
| Drilling | |||
| Minimum Hole Diameter | 0.*5mm | Minimum Distance from Hole to Board Outline | 8mil |
| Maximum Hole Diameter | 6.4mm | Minimum Size for Hole Ring | 4mil （Partially 3.2mil） |
| Hole Diameter Tolerance | ±2mil | The Minimum BGA Bonding Pad Design | ≥8mil (7mil is the Limitation) |
| The Distance from Hole to Hole | *0mil | The Minimum SMT Design | ≥7mil |
| Solder Mask | |||
| SM Bridge Width | ≥4mil | Minimum Width of Legend | 4mil |
| Minimum Size of SM Window | 3mil（Partially 2.5mil） | Minimum Hight of Legend | *3mil |
| The Minimum Distance from SM Window to Other Outline | 3mil | ||
| Surface Finished | |||
| HASL、ENIG、ENEPIG、Soft bonding gold(Soft Gold Plating)、Hard Gold Plating、Immersion Silver、OSP、Immersion Tin、ENIG+OSP、ENIG+G/F | |||
| Impedance | |||
| Whether it is capable of impedance testing |
Yes, it capable, it have |
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| 国家: | USA |
| 型号: | - |
| 离岸价格: | 10 ~ 10000 / Bushel 获取最新报价 |
| 位置: | Shenzhen |
| 最小订单价格: | 10 per Bushel |
| 最小订单: | 1 Piece |
| 包装细节: | - |
| 交货时间: | Shenzhen |
| 供应能力: | 7 Box per Week |
| 付款方式: | T/T, L/C, D/A, D/P, Western Union, Money Gram |
| 產品組 : | - |
