联系人 Judy
Shenzhen, Guangdong
Layer:*0
Board thickness:2.0mm
Copper thickness:
1oz(*5μm)
Board material: FR4 Normal
TG**0 SY***1
Surface finishing:ENIG
Min. line width:0.1mm
Min. line space: 0.*9mm
Min. hole size :0.2mm
Min. Copper thickness in hole wall:
*5.4μm
BGA diameter(PAD): 0.4mm
BGA: **0% Via plugged with SM
solder mask: Green(Japan Brand:
Sun)
Legend:White
**0% E-Test and AOI
IPC class 3
ROHs
Layer:
*0
Board thickness:2.0mm
Copper thickness:
1oz(*5μm)
Board material: FR4 Normal
TG**0 SY***1
Surface finishing:ENIG
Min. line width:0.1mm
Min. line space: 0.*9mm
Min. hole size :0.2mm
Min. Copper thickness in hole wall:
*5.4μm
BGA diameter(PAD): 0.4mm
BGA: **0% Via plugged with SM
solder mask: Green(Japan Brand:
Sun)
Legend:White
**0% E-Test and
AOI IPC class
3 ROHs
| 国家: | China |
| 型号: | - |
| 离岸价格: | 获取最新报价 |
| 位置: | - |
| 最小订单价格: | - |
| 最小订单: | - |
| 包装细节: | vacuum, box |
| 交货时间: | 12-22 days for FOB |
| 供应能力: | - |
| 付款方式: | T/T |
| 產品組 : | - |
