Laminates for wave soldering/reflow soldering pallets solder pallet materials

详情

TFUER-T**1
* Solder Pallet Materials

T**1 is a high-performance composite material specifically engineered for industrial and technical applications, including electronics, soldering, and assembly. Composed of fiberglass reinforcement and thermosetting resin, T**1 is designed for use in demanding environments. It is commonly employed in a variety of applications, such as solder pallets, insulating boards, and heat-resistant surfaces in electronic manufacturing, due to its excellent durability, thermal stability, and resistance to mechanical stress.

Key Features

• Heat Resistance: T**1 materials are known for their ability to withstand extremely high temperatures, making them ideal for use in soldering applications where heat is a critical factor.
• Electrical Insulation: These materials offer good electrical insulation properties, making them suitable for applications where conductivity needs to be minimized.
• Mechanical Strength: T**1 is designed to be durable, offering excellent mechanical strength and rigidity even at high temperatures.
• Chemical Resistance: These materials are also resistant to a wide range of chemicals and soldering fluxes, preventing corrosion and extending the lifespan of the products.
• Low Expansion: The materials have a low coefficient of thermal expansion (CTE), which means they resist deformation or warping under temperature changes, making them reliable for precision applications.

• Solder Pallets: T**1 is commonly used for solder pallets due to its excellent heat resistance and structural stability. The material can withstand the high temperatures encountered during wave soldering or reflow soldering processes.
• PCB Supports: Used in Printed Circuit Board (PCB) manufacturing, where it helps to hold PCBs in place during soldering without affecting the boards delicate components.
• Heat Insulation Boards: T**1 is often used in insulating boards to protect sensitive electronics from heat exposure during assembly and testing processes.
• Electronics Assembly: T**1 is also used in various other electronic manufacturing applications where heat resistance and durability are essential.

• Long-lasting: T**1 materials offer a long lifespan, even under high-temperature conditions, which reduces the need for frequent replacement.
• Cost-effective: While it is a high-performance material, T**1 is often more affordable compared to other advanced materials like ceramics, making it a cost-effective solution for industrial applications.
• Customization: T**1 can be tailored to meet specific material properties, such as thickness, shape, or resistance levels, depending on the requirements of the application.