联系人 Ms. Betty
NO1 Ruihua Road, Suzhou, Jiangsu
"Laser Slicer is widely used for industries of solar wafer and semiconductor, specially in silicon wafer process industrial. High quality laser beam, thin facula and small heating affection. Cutting scope: **0x**0mm, **0X**0mm. Cutting depth: 0.3mm Cutting width: 0.1mm Max cutting speed: **0mm/s Accuracy: +/*0.*1mm." Other Products
| 国家: | China |
| 型号: | TH-LSS200 |
| 离岸价格: | 获取最新报价 |
| 位置: | - |
| 最小订单价格: | - |
| 最小订单: | 1 |
| 包装细节: | - |
| 交货时间: | - |
| 供应能力: | - |
| 付款方式: | - |
| 產品組 : | - |
