Metal PCB

详情

Aluminum material and Cu material Description and Application Aluminum base copper-clad laminate have excellent flame retardant，high mechanical strength，dimensional stability etc. Especially it has very good heat sink，electromagnetic shielding and solder float. It’s widely used for the modifier and sparker on fire for motorcycle and mobile，power LED，sound box， power supply module and acoustics shielding system etc. ● The tapy and specification of Aluminum based Laminates CCAF**1，CCAF***-A，CCAF**5etc.and0.8mm，1.0mm， 1.5mm，2.0mm，3.0mm etc. ● thickness of the copper:*8um, *5um, *0um, **5um, ***** Base size: **0mm by **0mm (*3〞by *5〞); **0mm×**0mm (*0〞×*4〞)； **0mm×**0mm (*5〞×*6〞) CCAF**1 Aluminum-base copper-clad laminate Item Test item Technology request Unit Test result 1 Peel Strength A ≥1.8 N/mm 2 After thermal stress(**0℃) ≥1.8 N/mm 1.8 2 Blister test After thermal stress (**8℃, 2min) **8℃, 2min NO delamination / ok 3 Thermal resistance ≤2.0 ℃/W 1.0 4 Thermal-Conductive Factor 　 W/m.k 1.0 5 Flammability(A) FV.Q / FV.Q 6 Surface Resistivity A ≥1**0^5 MΩ 5**0^7 Constant humidity treatment (*0%, *5℃, *6h) ≥1**0^5 MΩ 2**0^6 7 Volume Resistivity A ≥1**0^6 MΩ.M 4**0^8 Constant humidity treatment (*0%, *5℃, *6h) ≥1**0^6 MΩ.M 5**0^7 8 Dielectric Breakdown(DC) ≥*8.5 KV/MM *1 9 Dielectric constant(1MHz) (*0℃, *3%, *6h) ≤4.4 / 4.2 *0 Dielectric dissipation factor(1MHz) (*0℃, *3%, *6h) ≤0.*3 / 0.*2 CCAF**5 Aluminum-base copper-clad laminate Item Test item Technology request Unit Test result 1 Peel Strength A ≥1.0 N/mm 1.*8 After thermal stress(**0℃) ≥1.0 N/mm 1.*5 2 Blister test After thermal stress (**8℃, 2min) **8℃, 2min NO delaminat