联系人 Tony
Building 3, No. 3, West Area, Shangxue Technology City, Bantian, Longgang District, Shenzhen, Guangdong
Layer: 1~*2 layers
Materials: FR*4, CEM*3, Teflon, Aluminum, Rogers, High Tg
Surface finished:Lead Free HASL,Immersion Gold/Tin/Silver, OSP,
Gold Finger Plating, Selective Immersion Gold,Gold Plating
Max.Panel Size: **0 * **0mm
Min. Finished Holes Size: 0.*0mm
Microvias diameter: 0.*0 - 0.*5mm
Min. Line Width/Spacing: 0.**5 / 0.**5mm
Copper Feature to Holes(Outer): ±0.**5mm
Min. Plated Drills to Copper(inner): 0.*5mm
Min. Copper to Edge distance: 0.*5mm
Max. Copper Thickness: **0μm
Max. Board Thickness: 4.*0 mm
Min. Board Thickness: 0.*0mm
Min. Core Thickness: 0.*0mm
Min. Soldermask Dam: 0.*0mm
| 国家: | China |
| 型号: | - |
| 离岸价格: | 获取最新报价 |
| 位置: | - |
| 最小订单价格: | - |
| 最小订单: | - |
| 包装细节: | - |
| 交货时间: | - |
| 供应能力: | - |
| 付款方式: | - |
| 產品組 : | - |
