Simple RD500 hot air BGA rework station

详情

1. This machine uses the intelligent heating, when the fan non-move, heating is not receiving power.

2. The COM connection, with the computer connection, realizes the high-end to return to the machinery of repair function.

3. Rich software function: Contact surface succinct friendly, the hypothesis, the revision, the preserved parameter, the parameter number of classes has not limited; The temperature curve test, the analysis, the printing, preserve; The automatic tracking thermal process, the thermal process curve draws up automatically; Temperature installation, temperature drift correction; Password locking mechanism, condition permission mechanism and so on. 

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4. Three .independent heating zone, suitable for lead-free process.

5. The first heating zone, a second heating zone heater using high-temperature heating material, producing a breeze, the third heating zone infrared heating plate heater to prevent PCB deformation;

6.6 temperature controls that simulate the effect of reflowing solder machine.

7. The first heating zone heater can be adjusted up and down, around, easy operation;

8. After the adoption of the heating of large flow constant fan on PCB for cooling to prevent PCB welding deformation, guarantee;

9. BGA remove, welding is voice prompts;

*0. Hand-held vacuum wand sucks BGA, convenient, reliable, durable;

*1. Card board with a special tooling for a wide variety of notebook motherboard;

*2. With. more than one size of hot air nozzle, or according to special requirements for custom;

*3. Adopting. P L C, human-machine interface control.

warranty:1 year