离岸价格
获取最新报价25000 ~ 45000 USD / Piece ( Negotiable )
|15 Piece Minimum Order
国家:
China
型号:
-
离岸价格:
25000 ~ 45000 USD / Piece ( Negotiable ) 获取最新报价
位置:
China
最小订单价格:
25000 per Piece
最小订单:
15 Piece
包装细节:
Vacuum Packing and wooden Box
交货时间:
30 working days
供应能力:
20 Piece per Month
付款方式:
T/T, L/C
產品組 :
-
联系人 Kensen
One of the most important parts of the surface mount assembly
process is the application of solder paste to the printed circuit
board (PCB). The aim of this process is to accurately deposit
the correct amount onto each of the pads to be soldered. This
is achieved by screen-printing the solder paste through a stencil
or foil but also can be applied by jet printing. It is widely
believed that this part of the process, if not controlled
correctly, accounts for the many assembly defects.
| 国家: | China |
| 型号: | - |
| 离岸价格: | 25000 ~ 45000 / Piece ( Negotiable ) 获取最新报价 |
| 位置: | China |
| 最小订单价格: | 25000 per Piece |
| 最小订单: | 15 Piece |
| 包装细节: | Vacuum Packing and wooden Box |
| 交货时间: | 30 working days |
| 供应能力: | 20 Piece per Month |
| 付款方式: | T/T, L/C |
| 產品組 : | - |
