This series product is with organic silicone as the main raw
material, add the thermal conductive filler of heat resistance and
heat conduction performance, to make a rubber type of the thermal
conductivity filler .
Under the premise of remaining high thermal conductivity,
fall hardness below *0 degrees (shore *0), greatly reduces
the stress on the kinds of complex space, small aperture, can
realize automatic generated in situ forming method. This series is
a type of colloid, don't need to assembly device, its low modulus
at the same time, to make it can be adaptive filling all
placed after curing, save time, improve production
efficiency.
