联系人 Mr. Anna
Zhengzhou,Henan,China, Zhengzhou, Henan
Silicon wafer back grinding wheels are
mainly used for the thinning and fine grinding of the silicon
wafer.
Coolant: Oil, emulsion
whatsapp *********8/***3
workpiece processed: silicon wafer of
discrete devices, integrated chips (IC) and
virgin,ATM, Melchiorre, Peter Wolters, Diskus, Viotto,
Wendt
Material of workpiece: monocrystalline
silicon and some other semiconductor materials.
Specifications
1.be used with Japanese, German, American,
Korea and Chinese grinders
2.superior grinding
performance
3.high cost performance
| Shape code | Profile Sketch | Conventional Specification (mm) | ||
| Out diameter D |
Thickness T |
Hole diameter H | ||
| 6A2 | **5 | *0, *5 | *6 | |
| **0 | *5 | *6 | ||
| **5 | *0 | **7 | ||
| 6A2T | **5 | *2.5, *5 | **0 | |
| **0 | *0 | **8.6 | ||
| **0 | *5 | **5 | ||
| 6A2T- | **9 | *2.5 | **8 | |
| 国家: | China |
| 型号: | - |
| 离岸价格: | ( Negotiable ) 获取最新报价 |
| 位置: | china |
| 最小订单价格: | - |
| 最小订单: | 1 Piece |
| 包装细节: | box |
| 交货时间: | 5-10days |
| 供应能力: | 3000 Piece per Month |
| 付款方式: | D/A, L/C, T/T |
| 產品組 : | - |
