联系人 Mr. Yu
1-2107 zhongshanhuafu, Shijiazhuang, Hebei
Overview
COMMODITY: TIN INGOT *9.9%
STANDARD: BS EN *******6(GRADE DESIGNATION *9.*0)
MARK:SN*9.*0
Detailed Product Description
COMMODITY:TIN INGOT *9.9%
STANDARD:BS EN *******6(GRADE DESIGNATION *9.*0)
MARK:SN*9.*0
Detailed Product
Description
Tin Ingot *9.*0 Sn *9.*0 Tin Ingot *9.*5 Sn
*9.*5 Tin Ingot *9.*9 Sn *9.*9
1.
High purity(Sn*9.*9 Sn*9.*5 Sn*9.*0), excellent weld ability, good
infiltration.
2.
Clean, After welding, insulation, high resistance, low ionic
contamination, PCB board welding residual minimal.
3.Good oxidation resistance, low tin slag and cost
savings.
4.
Solder joint is bright, full and uniform.
5.
Economical and can produce the lowest consumption of the solid
solder joints.
Specifications
| Purity(%) | As | Fe | Cu | Pb | Bi | Sb | Cd | Zn | Al | Total |
| *9.*9 | 0.***5 | 0.***5 | 0.***5 | 0.**4 | 0.***5 | 0.**2 | 0.***3 | 0.***5 | 5E**4 | 0.*1 |
| *9.*5 | 0.**3 | 0.**4 | 0.**4 | 0.*1 | 0.**6 | 0.**4 | 0.***5 | 0.***8 | 8E**4 | 0.*5 |
| *9.9 | 0.**8 | 0.***5 | 0.**8 | 0.*4 | 0.**5 | 0.*2 | 0.***8 | 0.**1 | 0.**1 | 0.1 |
| ELEMENTS DATA | UNIT | CONTENT | EXAMINE METHOD |
| TIN | *9.**9 | REMAINING | |
| SILVER | ICP | ||
| ALUMINUM | 0.**3 | ICP | |
| BISMUTH | 0.**2 | ICP |
| 国家: | China |
| 型号: | - |
| 离岸价格: | 获取最新报价 |
| 位置: | - |
| 最小订单价格: | - |
| 最小订单: | - |
| 包装细节: | - |
| 交货时间: | - |
| 供应能力: | - |
| 付款方式: | - |
| 產品組 : | - |
