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ZLH706 Laser Dicing Saw for Semiconductor Wafer Cutting
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ZLH706 Laser Dicing Saw for Semiconductor Wafer Cutting

离岸价格

获取最新报价

35000 USD / Set

|

1 Set Minimum Order

国家:

China

型号:

ZLH706

离岸价格:

35000 USD / Set 获取最新报价

位置:

shenyang, China

最小订单价格:

35000 per Set

最小订单:

1 Set

包装细节:

wooden box

交货时间:

2-3 month

供应能力:

100 Set per Year

付款方式:

L/C, T/T

现在联系
免费会员

联系人 Mr. shuo

242 Beihai Street, Shenyang, Liaoning

现在联系

详情

The ZLH **6 Laser saw machine is using industrial lasers, linear motor workbench and straight drive rotary platform, assisted by CCD image monitoring and positioning system, to cutting * * * *:*@******************** The machine has mounted with LCD touch screen, man-machine operation interface; the image alignment of the work piece is simple and convenient to improve the operation convenience. The self design software is used in the control system to improve the cutting efficiency. The equipment has high reliability, low cost maintenance and stable performance







Feature

Interactive man-machine operation interface

*5" high resolution touch screen;

Easy operation, highly working efficiency;

Fiber Laser adopted;

Laser wave is ***4 nm;

Power rating is *0W

国家: China
型号: ZLH706
离岸价格: 35000 / Set 获取最新报价
位置: shenyang, China
最小订单价格: 35000 per Set
最小订单: 1 Set
包装细节: wooden box
交货时间: 2-3 month
供应能力: 100 Set per Year
付款方式: L/C, T/T
產品組 : Dicng Saw Machine

Send a direct inquiry to this supplier

至:

Mr. shuo < SAIS CO., LTD. >

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