详情
1). 1+C*1 HDI, buried/blind L*-L5/L*-L8 vias.
2). FR*4 Material, 1 oz weight.
3). 8 layer, 1.6mm thick.
4). 4/4 mils track and space
5). Min.drill 0.1mm
6). Green solder mask/ white silkscreen
7). Immersion gold over nickel
1). 1+C*1 HDI, buried/blind L*-L5/L*-L8 vias.
2). FR*4 Material, 1 oz weight.
3). 8 layer, 1.6mm thick.
4). 4/4 mils track and space
5). Min.drill 0.1mm
6). Green solder mask/ white silkscreen
7). Immersion gold over nickel
