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最小订单:
1-100pieces
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联系人 Mr. Michael
Nanshan Estate, Shenzhen, Guangdong
Material: FR4 TG***0 Thickness: 1.5mm Layer account: 4 PCB size: *8 x *9mm Minimum via size: 0.2mm Minimum trace/space: 0.*2mm pads treatment: flash gold Material used: FR4, high Tg minimum **0°C, high frequency Metal based: aluminum Maximum panel size: *6 x *6 inches (**0 x **0mm) Line width and spacing: Minimum line width (internal): 4 mil (0.1mm) Minimum line width (external): 4 mil (0.1mm) Minimum line spacing (external): 4 mil (0.1mm) Layer count and thickness: 2 - *2 layers Via/drill size: minimum drill hole diameter *0mil (0.*5mm) Minimum via size: 8 mil (0.1mm) Micro via: 4mil (0.1mm) Solder mask: solder mask bridge between solder dam 3mil (0.*7mm) War page: 0.5% Impedance: +/- *0% Surface finish: hard gold/ENIG/HASL/carbon ink/OSP (ENTEK CU **6 AX)/immersion tin Minimum SMT pitch: *2mil (0.2mm) Minimum parts foot pins: ***1