As a new and high capability substrate, DBC substrates have been
used widely in electric power and electronic industry.
The high thermal conductivity of Al2O3 (*4W/mK) and
AIN(**0W/mK) combined with the high thermal capability of thick
high purity copper(typically 0.2mm or 0.3mm thick copper) make DBC
the most popular material choice for power chip on
board assemblies.
