离岸价格
获取最新报价|
Minimum Order
位置:
Shenzhen,China
最小订单价格:
-
最小订单:
10 Piece
包装细节:
vaccum inner outer with carton box
交货时间:
3-7days
供应能力:
500 Piece per Day
付款方式:
T/T, L/C, Western Union
联系人 Ms. Carol
Rm.1810,Noble Plaza,Qianjin 1st Road,Baoan Center District,, Shenzhen, Guangdong
Our PCB Technical capabilities
|
NO |
ITEM |
Our PCB Technical capabilities |
|
1 |
Layers |
***0 layers |
|
2 |
Max. Board size |
***0×**0mm |
|
3 |
Min. board Thickness |
*-layer 0.*5mm |
|
*-layer 0.*8mm |
||
|
*-layer 0.*5mm |
||
|
*-layer 0.*0mm |
||
|
**-layer 1.0mm |
||
|
4 |
Min. line Width/Space |
0.**5mm(3mil) |
|
5 |
Max. Copper thickness |
6OZ |
|
6 |
Min. S/M Pitch |
0.**5mm(3mil) |
|
7 |
Min. hole size |
0.1mm(4mil) |
|
8 |
Hole dia. Tolerance (PTH) |
±0.*5mm(2mil) |
|
9 |
Hole dia. Tolerance (NPTH) |
*0/*0.*5mm(2mil) |
|
*0 |
Hole position deviation |
±0.*5mm(2mil) |
|
*1 |
Outline tolerance |
±0.*0mm(4mil) |
|
*2 |
Twist & Bent |
0.*5% |
|
*3 |
Insulation Resistance |
>***2 &branded; Normal |
|
*4 |
Electric strength |
>1.3kv/mm |
|
*5 |
S/M abrasion |
>6H |
|
*6 |
Thermal stress |
**8°C *0Sec |
|
*7 |
Test Voltage |
*****0V |
|
*8 |
Min. blind/buried via |
0.*5mm (6mil) |
|
*9 |
Surface Finished |
HAL, ENIG, ImAg, Imsn OSP, Plating AG, Plating gold |
|
*0 |
Materials |
FR4,H-TG,Teflon,Rogers,Ceramics,Aluminium, Copper base |
