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Spherical silica powder(Underfiller, EMC and so on )

Spherical silica powder(Underfiller, EMC and so on )

离岸价格

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( Negotiable )

|

Minimum Order

位置:

CHINA

最小订单价格:

-

最小订单:

50 Kilogram

包装细节:

Packing by brown paper drum with 25kg net per drum (25Kg/Drum) or 25Kg net per pp bag within plastic

交货时间:

-

供应能力:

50 Metric Ton per Month

付款方式:

L/C, T/T

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免费会员

联系人 peng

Building 6 Area A Shuanghuayuan Nanli,Chaoyang District,, Beijing, Beijing

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详情

 

1.  Application

The SSP series of spherical fused silica powder have a mono-dispersed, surface smoothness, good fluidity, low coefficient of thermal expansion characteristics which can be widely used in the EMC, electronic packaging,Electronic adhesive,Copper Clad Laminate,Underfiller, daily chemical products and so on.

 

2.  Main Specifications

SiO2 Purity: *9.*5% min.

Size: D*0, 0.***0um per the user’s demands. 

layne
pengl $ sinosi , org

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至:

peng < SINOENERGY GROUP >

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