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Sell multi-layer immersion Ag printed circuit board

Sell multi-layer immersion Ag printed circuit board

离岸价格

获取最新报价

0.1 ~ 0.5 / Piece ( Negotiable )

|

Minimum Order

位置:

China

最小订单价格:

最小订单:

1 Piece

包装细节:

vacuum packing, carton box

交货时间:

6wd

供应能力:

15000 Square Meter per Month

付款方式:

T/T, Western Union

现在联系
免费会员

联系人 Ms. candy

Kaifeng Rd.No.4, Shenzhen, Guangdong

现在联系

详情


1, copper clad pcbprinted circuit board manufacturer

2,ShengYi FR4 material
3,immersion gold

4,green solder mask
5,white silk

6,Board thinkness 1.6mm

7.pcb certificate:UL/SGS/Rohs/ISO***1/ISO****0
8.OEM service offered
9.competitive price

*0.timely delivery  

 

 

Quotation time:

 

 

 

1. For PCB & FPC: quotation within 1 hours if all information are clear

 

2. For PCBA:  quotation within 2 days if all information are clear

 

 

 

One-stop Service:

 

  

 

1. PCB Copy

 

2. PCB drawing / design according to your schematic diagram

 

3. PCB manufacturing

 

4. Component sourcing

 

5. PCB Assembly

 

6. PCBA test

 

 

 

Delivery Time: 

 

Layers               Sample              First Order             Repeat Order    
Single side 3 days 7 days 6 days
Double side 4 days 8 days 7 days
4 Layer 7 days 9 days 8 days
6 Layer 8 days *0 days 9 days
8 Layer *0 days *2 days *0 days
*0 Layer *2 days *4 days *2 days
Alu-base 3 days 8 days 7 days
FPC 1 layer 5 days 8 days 8 days

 

 

 

Shipping Method:

 

 

 

1. By DHL, UPS, FedEx, TNT using clients account

 

2. We suggest you using our DHL, UPS, FedEx, TNT forwarder

 

3. By EMS (Usually for Russia Clients), price is high

 

4. By sea for mass quantity according to customer's requirement

 

  

 

PCB Production Capability:

 

 

Files

Gerber, Protel, Powerpcb, Autocad, Orcad, etc

Material

FR*4, Hi-Tg FR*4, Lead free Materials (RoHS Compliant) , FR1, CEM*3, CEM*1, Aluminium, High frequency Material (Rogers, Teflon, Taconic)

Layer No.

1 - *2 Layers

Board thickness

0.***5"(0.2mm)*0.**5"(3.2mm) 

Board Thickness Tolerance

±*0%

Copper thickness

0.5OZ - 4OZ

Impedance Control

±*0%

Warpage

0.**5%*1.5%

Peelable

0.**2"(0.3mm)*0.*2’(0.5mm)

Min Trace Width (a)

0.**4"(0.1mm)

Min Space Width (b)

0.**4"(0.1mm)

Min Annular Ring

0.**4"(0.1mm)

SMD Pitch (a)

0.**2"(0.3mm)

pcb with green solder mask and LF-FREE surface finishing BGA Pitch (b)

0.**7"(0.**5mm)

Regesiter torlerance

0.*5mm

Min Solder Mask Dam (a)

0.**5"(0.**5mm)

Soldermask Clearance (b)

0.**5"(0.**5mm)

Min SMT Pad spacing (c)

0.**4"(0.1mm)

Solder Mask Thickness

0.***7"(0.**8mm)

Hole size

0.**8"(0.*0mm)*- 0.**7"(6.5mm)

Hole Size Tol (+/-)

±0.**3"(±0.***2mm)

Aspect Ratio

*0:*1

Hole Registration

0.**3"(0.**5mm)

HASL

2.5um

Lead free HASL

2.5um

Immersion Gold

Nickel  **7um  Au:**3u''

OSP

0.**0.5um

Panel Outline Tol (+/-)

±0.**4''(±0.1mm)

Beveling

*0°*5°

V-cut

*5° *0° *5° *0°

Surface finish

HAL, HASL Lead Free, Immersion gold, Gold plating, Gold finger, immersion silver, immersion Tin, OSP, Carbon ink,

Certificate 

ROHS  ISO***1 TS****9  SGS  UL

Special requirements

Buried&blind vias, Impedance control, via plug, BGA soldering and gold finger

Send a direct inquiry to this supplier

至:

Ms. candy < FZ-PCB Technology CO., Limited >

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