1,
Materials: CEM3, FR2, FR4 and AL
2, Processes: HASL, Au plating, Au/SP immersion and OSP
3, Layers: 1 to *2
4, Conventional coating: ***1, ***2, ***3, ***5, ***0 and ***2
placement 5, Minimum precision:BGA: 0.5mm IC: 0.4mm
6, PCB fabrication, hand insertion, metal assembly and function
test
7, Experienced components sourcing team
8, Specially for scarce parts
9, 1 to *2 layers mixed assembly technology
*0, Specialized in assembling boards for safety, industry control
and power boards *1,
Type of production line and supports:SMT (Yamaha and Sanyo
machine) *2,
Plastic injection factory
*3, Die-cast and sheet metal stamping
factory *4,
X-ray/ICT test, function test and assembly
line *5,
One stop station EMS services provider *6,
Various specifications are available
