Completely self-developed MEMS Hot-film silicon chip featured with
compactness, high accuracy, short response time & reverse flow
detection
Our unique design air intakes featured with more stable intake air
flow and more accurate measurement
Intelligent signal processing circuit;PCB design;All the devices is
mounted by SMT with reliable performance.
Aluminium wire bonding, advanced automatic aluminium wire bonding
equipment, featured with reliable performance and good
uniformity.
Gel casting technology make the circuit component be protected
against moisture, shock, which offers greater reliability.
Encapsulation materials is made of PBTGF*0, featured with following
advantages:high mechanical strength;resistance to press;high heat
resistance.
