详情
Fiber Laser date coding Machine
laser marking speed: ***0mm/s
life span: **6 Years
high speed, no consusmables,
HMF**0AP Fiber Laser date coding
Machine
Brief
Introduction:
The beam quality of Fiber laser date coding machine is much
excellent than the conventional solid-state laser marking machine.
The beam is on the basis of basic mode (TEM*0) output, and its
diameter of focus laser dot is less than *0 micron, Radiation angle
is 1/4 of Diode-pumped laser tube , so it is more suitable for
precise and fine marking. HMF Series fiber laser marking machine
has the advantage of high electro-optical conversion efficiency,
reduced size, high output beam quality, high reliability, long life
span, low energy consumption and other advantages.
Features:
1. Advanced hardware control technology and intelligent
software.
2. Advanced laser technology, adjustment-free, high stability,
maintenance-free time for *0 million hours.
3, High pumping efficiency can significantly enhance the quality of
the output beam.
4. Can easily be assembled intomulti-dimensional space, making the
design of the whole mechanical system simple.
5. Low power consumption saves operation cost.
6. Air cooling system reduced the size greatly
7. High tolerance ability in harsh working condition such as dust,
shock, humidity, temperature
8. Support pipeline operations.
9. Non-toxic marking: non-contact marking to avoid any pollution on
the workpiece
High marking speed, **3 times of the traditional laser marking
machine.
Powerful
software:
Windows Interface, can be compatible with the PLT, JPG, DXF,AI,
DST,TGA, PNG, TIFF, BMP file formats of software AUTOCAD,
CORELDRAW, PHOTOSHOP, etc. Besides it also can Support auto-coding,
serial number, bar code, date, batch number and 2D barcode.
Tech
parameter
| HMF**0w Laser
coding Machine |
| Output Power |
*0W |
| Total Power |
**0W |
| Marking Scope |
*0mm**0mm,**0mm***0mm,***0mm***5mm |
| Wave Length |
***4nm |
| Power adjust scope |
*****0% |
| Beam Qulity M2 |
1.**1.8 |
| Min focus spot size |
0.**5mm |
| Repeated Frequency |
****0KHz |
| Marking Depth |
Adjustable |
| Max Marking Speed |
≤***0mm/s |
| Min Character Size |
0.*5mm |
| Min line width |
0.*1mm |
| Repeated accuracy |
±0.1um |
| life span of Laser Module |
>*****0 Hours |
| Laser |
German IPG |
| Cooling |
Air Cooling |
| galvanometer |
High speed scanning
galvanometer |
| Electric Power |
**0V/Single-Phrase/*0Hz
/4A |
4.Industrial
Application:
Suitable for metallic materials and some non-metallic materials,
mainly used for industry that have high requirement on depth,
smoothness, tolerance, such as watches, mold, bitmap marking and so
on.
1. Auto Industry: Bearings, Steel sleeve, piston rings, engine tag,
car panel buttons, spare parts of machine tool;
2. Electronic communications industry: the phone keypad, keyboard,
electronic components, home appliances panel, cable, cable, etc
3. Hardware tool industry: tools, measuring tools, cutting tools,
sanitary ware, cutlery, locks, knives, scissors, medical equipment,
fitness equipment, stainless steel products;
4. Buckle sign industry: buttons, luggage buckle, belt
buckle, gold and silver ornaments, signs, badges, time cards,
business cards, greeting cards, calendars, photographs ,leather
purses, belts, pens and pencil cases, trophies and various
certificates , the collection device, works of art, stamps,
plaques, etc.; meter and glass industry: metal case, bottom of the
table, glasses frames, instrument panels, etc.;
5. Wood craft industry: wooden crafts, calligraphy copy and Picture
mounting, furniture decoration, etc.;
6. Packaging industry: tobacco, food, medicines, cosmetics and
other internal and external packaging, metal caps, cans,
etc.
5.
Material:
common metals and alloys (iron, copper, aluminum, magnesium, zinc
and all other metals), rare metals and alloys (gold, silver,
titanium), metal oxide ( any kinds of metal oxide may be), special
surface treatment (phosphate, aluminum anodizing, plating surface),
ABS material (appliances shell, daily necessities), ink
(translucent keys, printed products), epoxy resin (encapsulation of
electronic components, insulation layer)
