Model:
YSPE
Size(mm): **0 X **0
X ***0
Power supply(v): **0/**0
Depression(Pa): 0.***0.*0
Weight(Kg): **0/**0
FPC /PCB punching (YSPE)
1.Depaneling PCB/FPC by means of punching dies, to avoid
micro-cracks caused by manual.
2.Cast iron framework for rigidity. Punching dies are changeable.
Easy set up of punching dies.
3.Moveable lower die for easy loading and unloadingPCB punch die|
FPC die| PCB punch mold| FPC mould
