联系人 Ms. jiang
xixiang, shenzhen, guangdong
layer =*0 board Thickness=0.**5.0mm min board thickness:4layers=0.4mm 6layers =0.8mm 8layers=1.2mm *0layers=1.5mm min line width=0.*0mm=4mils min space=0.*0mm=4mils min hole size=0.1mm palted wall thickness=0.**5mm=1mils Min SIM bridge=0.1MM=4mils twist and bent<1.5% current strenath=*0A peel strenath=1.4N/mm solder mask abrasion.4H Thermal stress=**8C *0(second) flammability=*0V_0 Test Voltage=*****0v
