If you don\'t know how to recover/rescue data from a broken android smartphone with our tools, please contact us anytime by email or message.
We know how to rescue pictures( jpg ), phonebook( telephone numbers ) ,phone message
and many other data. It\'s very easy to
use. If you have a stronger software, you can do more.
We are original manufacturer. High quality
and best price for you.
We are looking for agents. If you are interested in our products please don\'t hesitated to contact us.
Some popular emmc and emcp type numbers:
THGBM5G7A2JBAIR,THGBM5G7B2JBAIMA*0,THGBMAG8A4JBA4R,H*6M****3HPR,THGBMBG6D1KBAIL,THGBMBG5D1KBAIT,THGBMAG5A1JBAWR,THGBMFG6C1LBAIL,THGBMBG6D1KBAIL,THGBMAG6A2JBAWR,THGBMFG7C2LBAIL,THGBMBG7D2KBAIL,THGBMAG7B2JBAWM,THGBMFG8C4LBAIR,THGBMBG8D4KBAIR,THGBMAG8B4JBAWM,THGBMFG9C8LBAIG,THGBMBG9D8KBAIG,THGBMFT0CBLBAIS,THGBM4G4D1HBAIR,THGBM5G5A1JBAIR,THGBM5G6A2JBAIR,THGBM5G7A2JBAIM,THGBM5G8A4JBAIM,THGBM5G9B8JBAIE,THGBM4T0DBGBAIJ,THGBM5G8B4JBAIM,KLM4G1FEAC-C**1,KLM8G1WE4A-A**1,KE4CN4K6A-A*8,KLMAG2GE4A-A**1,KLMAG4FE3B-A**1,KLMAG4FEJA-A**2,THGBM4G7D2GBAIE,SDIN5C***6G,SDIN5C***6G,KLMAG4FEJA-B**1,KLMCG8GE4A-A**1,H*6M****3DQR,H*6M****3BFR,H*6M****3EMR,KLM8G2FE3B-B**1,KLMCG8GE4A-A**1,KLMAG2GEAC-B**1,KLMBG4GEAC-B**1,KLMBG4GEAC-B**1,H*6M****3FMR,SMJ*5U8GLUEA-FT,KLM8G1GEAC-B**1,KLMAG2GEAC-B**1,KLMBG4GEAC-B**1,KLMCG8GE2A-A**1,KLMCG8GEAC-B**1,KLM4G1YEMD-B**1,KLM8G1WEMB-B**1,KLMAG2WEMB-B**1,KLMBG4WEBC-B**1,KLMCG8WEBC-B**1,KLM8G1GEAC-B**1,KLMAG2GEAC-B**1,KLM8G1GEND-B**1,KLMAG2GEND-B**1,KLMBG4GEND-B**1,KLMCG8GEND-B**1,KLM8G1WEPD-B**1,KLMAG2WEPD-B**1,H*6M****2ANR,SDIN8DE***6G,H9TP*2A8JDBCPR-KGM,KMN5U**0ZM-B**3,H9TP*5A8JDACPR-KGM,H9LA2GH1GJCMCR**6M,KAP**2N*0A-BWEW,KMR*****8M-A**1,H9TP*7ABLDMCNR_KGM,H9TA4GH2GDMCPR*4GM,KMQNW**0SM-B**6,KMR*****1M-B**1,H9TP*2A8JDACPR-KGM,H9TP*2A8JDDCPR-KGMR,KMK7X**0VM-B**4
We
provide a simple software which can check the capacity, read, write
and verify. Please send us an email if you need
it.
1) Test, debug, validation, and programming of eMMC
devices.
2) Failure analysis / System and wafer
test.
3) Package and Chip
qualification.
4) Production prototype / Data
recovery.
