Tin plating round copper
wire Adopt advanced retreat plating machine
production, choose conform to the requirement of national standard
GB/T ********3 of naked round copper wire, tin tin chosen conform
to the requirement of national standard GB/T*******8 a number of
pure tin, the use of advanced vacuum tube type continuous annealing
hot dip tin plating process.Tin plated copper conductor surface can
prevent bare copper wire, direct contact with rubber produces
chemical reaction, which in turn lead to resistance increases, the
ageing phenomenon such as lower mechanical strength.So tin plated
copper wire with small resistance, good resistance to oxidation,
the advantages of easy to solder.Tin plating round cable specialist
is responsible for monitoring the whole process of various
parameters, ensure the quality of the products and performance are
in accordance with the standards set by the national
GB/T*******9. Application: tinned copper wire is mainly used
for rubber insulated cable for mine, soft wire, cable and Marine
cable wire core, and used as insulated wire and cable shielding
layer and outside brush wire, etc. Product
features: 1, tin plated copper wire has excellent
weldability. 2, as the change of time, still keep good
weldability, can be stored for a long
time. 3, surface smooth, bright and
moist. 4, performance is stable and reliable, to ensure
the high quality and high yield. Scope of
application: 1, resistance and
capacitance; 2, photosensitive element, diode and crystal and
sensors; 3, jumpers and other electronic components;Wire,
cable manufacturers preferred
products; Product
performance: 1, the tensile strength, or **5 kg/mm bent over
and over again: p 4 times 2, extension ratio: *5% or greater (or according
to customer\'s requirement) 3, tin plating thickness: thin plating: plating
in the 1.5 2.5 mm, 3.**4.0 mm thick plating: more than 4
mm 4, wire diameter, allowable deviation plus or
minus 0.*1 mm 5, appearance: surface light, colour and lustre
is uniform, no tin, shading, crack, burr, yellowing, tin
tumor 6, solderability: **0 +
2℃lead-free tin dipped 2 + / - 0.5 s, more than
*5% of the new tin can be attached
to 7, aging test: **0 +
5℃bake for 1 hour, no yellow and black
phenomenon 8, continuity, hydrochloric acid, sodium
polysulfide solution experiments three cycle, no dew copper, black
spots 9, binding force, the winding 6 circle above in
saturated sodium polysulfide leaching test, no crack,
black.
