■ Main Handling
Applications (1) Big-Size Flat
Film and Panel
(2) Big-Size Warp Wafer Transfer and Moving
(3) Semiconductor BGBM Thin Wafer
(4) Thin Warp Wafer
(5) Move-Free Shape Reinforcement
(6) Cupper Foil
(7) Soft Film
(8) Curved Glass
(9) Vacuum Lamination in OLED, Touch Panel
(*0) Vacuum deposition
■ Product
Features (1)
Coulomb-Force Electrostatic Chuck. (2) Patent Coulomb-Force
E-Chuck was developed long time and has dozens of international
patents. (3) Stable and uniform
adhesion force is achieved by applying the voltage to the
electrode (4) Apply lowest voltage to
keep maximum adhesion force. (5) Because voltage potential
of object backside is zero, adhesion will not affect the backside
circuits. (6) Be able to adhere various
materials : metal / semiconductor / glass / paper / porous
materials. (7) Work normally in a vacuum
environments and general atmospheric environments. (8) Can define adhesion area
and non-adhesion area. Non-adhesion area can define other
functions. (9) Can be made by different
substrates. Such as stainless, aluminum, ceramic, semiconductor
wafer or glass. (*0) Can be customized into
various sizes and thicknesses for customer\'s
applications. (*1) Advanced technology enclose
electrical field in the E-Chuck. E-Chuck become as move-free
carrier.
(*2) After adhesion setting, Move-Free Supporter can move freely
even disconnecting the power supply. Move-Free support can support
hardness or shape reinforcements for thin wafer or glass
panel.
