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Hot sale Thermal conductive gel thermal conductive silicon filler Liquid heat conducting gel

Hot sale Thermal conductive gel thermal conductive silicon filler Liquid heat conducting gel

离岸价格

获取最新报价

( Negotiable )

|

Minimum Order

位置:

-

最小订单价格:

-

最小订单:

10 Piece

包装细节:

50cc/pc, 48pcs/box; 400cc/pc, 9pcs/box

交货时间:

3-7days

供应能力:

-

付款方式:

T/T

现在联系
免费会员

联系人 Sophia

B8 building, Dongguan, Guangdong

现在联系

详情

Hot sale Thermal conductive gel thermal conductive silicon filler Liquid heat conducting gel
 

Ziitek TIF**5AB**5S is a highly thermal conductive, liquid gap filling material. It is provide with two-component and different temperature curing system. The product was supplied as highly thermal conductive, soft and elastomer for coupling on electrical devices modul. Heat can transmit to the metal housing or dissipation plate from the separate elements or even the entire PCB, which in effect enhances the efficiency and life-time of the heat-generating electronic components. It is liquid approach offer variety of thickness, replacing individual die-cut and specific pad thickness. Different from grease, the cured product is dry and can be touch. It can intented for use in thermal applications.


Feature

< Good thermal conductive: 3.5W/mK
< UL recognized
< Naturally tacky needing no further adhesive coating
< Two-part formulation for easy storage
< High durability
< Optimized shear thinning characteristics for ease of dispensing

 

Applications

< Notebook
< Set top boxes
< Monitoring the Power Box
< High speed mass storage drives
< Heat sink any heat generating semiconductor

 

Typical Properties of TIF**5AB**5S Series
Typical Uncured Material
Property Numerical Test Method
Color/Part A White Visual
Color/Part B Blue Visual
Viscosity as Mixed (cps) **0,**0 cps ASTM D***6
Density 3.1g/cc ASTM D**2
Mix Ratio 1:1 ******
6 months ******
Cure Schedule
Pot Life

Send a direct inquiry to this supplier

至:

Sophia < Dongguan Ziitek Electronical Material and Technology Ltd >

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