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Copper Clad Laminate-CCL

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联系人 cumarketing-cn.8122.063327

20 Floor Yuan Mansion, 738 Dongfang Road, Shanghai, Shanghai

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产品规格

详情

Specifications of Copper Clad Laminate: 1. Brand: SMC
2. Thickness: 0.2mm*3.2mm, or custom
3. Color: black, yellow, natural,etc.
4. Available Sizes: *7.3〞X *9〞, *7.3〞X *9.3〞, *0〞X *8〞(***6mmX***9mm),*1〞X *9〞, *1.3〞X *9.3〞, *2〞X *8〞, *3〞X *9〞, *3.3〞X *9.3〞, *9〞X *9〞, *9.3〞X *9.3〞, or custom.
5. Types: single sided FPCB, double sided FPCB, etc.
6. Applications: widely used in military, aerospace, automotive and consumer electronics, etc. 
 

Available Sizes
(Customized sizes are accepted)

*7.3〞X *9〞(***6mmX***9mm)

*7.3〞X *9.3〞(**7mmX***2mm)

*0〞X *8〞(***6mmX***9mm)

*1〞X *9〞(***1mmX***5mm)

*1.3〞X *9.3〞(***9mmX***2mm)

*2〞X *8〞(***7mmX***9mm)

*3〞X *9〞(***2mmX***5mm)

*3.3〞X *9.3〞(***0mmX***2mm)

*9〞X *9〞(***5mmX***5mm)

*9.3〞X *9.3〞(***2mmX***2mm)


1. Single sided FPCB
One single conductive layer,either bonded between two insulating lamination or uncovered on one side.
2. Double sided FPCB
Two conductive layers with an insulating layer inside, plus cover layers on outer layers. They can be fabricated with or without Plated through holes (PTH).Plated through holes(PTH)provide a good connection. 
  Features of Copper Clad Laminate:
  1.  High tear strength
  2.  High peel strength
  3.  High thermal resistance
  4.  High flexural endurance
  5.  Wide processing latitude
  6.  Low moisture absorption
  7.  Excellent dielectric thickness tolerance
  8.  Excellent dimensional stability
  9.  High modulus for reliable COF wire bonding
Parameter of Copper Clad Laminate

Item

Manufacture Capability

Material

FR*4 / Hi Tg FR*4 / Lead free Materials (RoHS Compliant) /CEM*3, Copper, Aluminum, etc.

Layer No.

***6

Finished Board thickness

0.2 mm*3.2mm

Board Thickness Tolerance

±*0%

Cooper thickness

0.5 OZ**1OZ (*8 um***5 um)

Copper Plating Hole

****0 um

Impedance Control

±*0%

Warp &Twist

0.*0%

Peelable

0.**2"(0.3mm)*0.*2’(0.5mm)

Min Trace Width (a)

0.1mm (4 mil)

Min Space Width (b)

0.1mm (4 mil)

Min Annular Ring

0.1mm (4 mil)

SMD Pitch (a)

0.2 mm(8 mil)

BGA Pitch (b)

0.2 mm (8 mil)

Holes

Min Hole size (CNC)

0.2 mm (8 mil)

Min Punch Hole Size

0.9 mm (*5 mil)

Hole Size Tol (+/-)

PTH:±0.**5mm;NPTH: ±0.*5mm

Hole Position Tol

±0.**5mm

Plating

HASL

2.5um

Lead free HASL

2.5um

Immersion Gold

Nickel **7um Au:**5u''

OSP

0.**0.5um

Outline

Panel Outline Tol (+/-)

CNC: ±0.**5mm, Punching: ±0.*5mm

Beveling

*0°*5°

Gold Finger angle

*5° *0° *5° *0°


Applications of Copper Clad Laminate: > Computer devices: soft disk driver, power supply device, CPU board;
> Lighting: road lighting ,LED outer wall lighting, LED stage lighting;
> Telecommunication devices: filter circuit, automobile telephone; 
high frequency booster of mobile telephone, transmitting circuit.
> Electronic devices in automobile: igniting device, voltage regulator, 
auto safety control system, electromagnetic wave shield material;
> Power supply: switch, switch regulator, transformer, large power, 
base board of solar cell;
> Electronic control: transistor base, radiator, switch board,
insulating heat conductive board in semiconductor, motor control device
 

国家: China
型号: -
离岸价格: 获取最新报价
位置: -
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產品組 : Copper Sheet & Plate

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cumarketing-cn.8122.063327 < Shanghai Metal Corporation >

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