离岸价格
获取最新报价|
20 Piece Minimum Order
国家:
China
型号:
DB118
离岸价格:
位置:
-
最小订单价格:
-
最小订单:
20 Piece
包装细节:
-
交货时间:
-
供应能力:
-
付款方式:
-
產品組 :
联系人 Ms. Docbond
628Jiushui East Road Laoshan District, Qingdao, Shandong
DB**8
This product is a one-component epoxy resin adhesive with high thermal conductivity, which is the best matching adhesive for thermal bonding of chips. Applicable to all kinds of electronic products, characterized by rapid thermal curing, and easy to apply. Upon cure, it has high bonding strength, good thermal conductivity, low shrinkage, low moisture absorption, good insulation performance, etc., which can reduce the working temperature of the chip, extend the life of the chip
| 国家: | China |
| 型号: | DB118 |
| 离岸价格: | 获取最新报价 |
| 位置: | - |
| 最小订单价格: | - |
| 最小订单: | 20 Piece |
| 包装细节: | - |
| 交货时间: | - |
| 供应能力: | - |
| 付款方式: | - |
| 產品組 : | Electronic glue |
