EGYFIX GASKET

EGYFIX GASKET

*1 DESCRIPTION is a high-performance silicone sealant developed for sealing, bonding and repairing
works where heat resistance is required. It is an ideal sealant for high temperature construction
applications. It reacts with atmospheric moisture to produce an elastic tough silicone.
*2 PROPERTIES • Excellent heat resistance up to ***0 °C permanently and up to **0 °C intermittently
• %**0 silicone
• Fast cure, high strength
• Remains flexible at low (**0 °C) and high (***0 °C)temperatures.
• Will not crack, shrink or become brittle
• One component, acetoxy cure, RTV silicone
*3 APPLICATIONS  • Sealing and bonding applications in automotives
• Industrial owens
• Sealing and bonding in stoves
• In heating devices
• Sealing heating systems
• Gaskets in pumps and motors
• Heating elements in appliances
• In sealing chimneys
• Other bonding and sealing applications where parts must perform at high temperatures
*4 STOROGE AND SHELF LIFE   *2 months if stored in dry and cool conditions.
*5 PACKAGING
Product Volume Package
HT **0 **0ml *4
Red/Blister *0gr *4
Black/Blister *0gr *4
Red/Blister *0gr *0
Black/Blister *0gr *0
Blue/Blister *0gr *0
Red/Blister *0gr *0
Red/Blister *0gr *0
*6 RESTRICTIONS   For best result, apply the sealant between *5 °C and **0 °C. Surfaces must be clean, dry, oil and
frost free. The sealant must be tooled immediately after the application before a skin forms. Excess
uncured sealant may be cleaned with solvent. Cured sealant can be removed barely mechanically.
*7 SAFETY  If inhaled in over a prolonged period or in large volumes, the acetic acid vapours released during
curing may cause irritation of the respiratory system. Therefore, the application must take place in a
well-ventilated area. Prolonged contact with uncured sealant must be avoided
*8 TECHNICAL PROPERTIES   Cure system :Acetoxy
Temperature strength :Permanently **0 °C Temporarily **0 °C
Specific gravity :1,*1 - 1,*3
Track-Free time :****0 min (at *3 °C and *0% R.H.)
Curing rate :Min.3mm/day (at *3 °C and *0% R.H.)
Application temperature :*5 °C to + *0 °C