联系人 Mr. David
Wenjing, Nanjing, Jiangsu
Features in; 1. Series or parallel the igh efficient crystal silicon chips 2. Adop advanced lead-free welding and no-clear solder. 3. Glue Connection>*0% 4. Automatic lamination technology, and hot-pressing sealed by high transmittance and low iron toughened glass, anti-aging EVA and excellent fire resistance of TPT. 5. Thicker hollow and aluminum frames packaging. 6. Connecting box has TUV approval.
| 国家: | China |
| 型号: | B-SP-P |
| 离岸价格: | 获取最新报价 |
| 位置: | - |
| 最小订单价格: | - |
| 最小订单: | 100 |
| 包装细节: | - |
| 交货时间: | - |
| 供应能力: | - |
| 付款方式: | - |
| 產品組 : | - |
