SINOSI GROUP face
the global market to supple the SSP series of spherical fused
silica powder which own monodispersion, smooth surface, good
fluidity and low thermal expansion coefficient and other
characteristics. In view of these
characteristics,spherical
silica powder can be widely used in large-scale and super-large-
scale integrated circuit packages and Insulating pouring of
electronic components and high voltage devices. It is also
applied to high-class rubber tires, silastic, silicon-based
substrate materials, high-grade ink, Coating material,
sealants, adhesives, electronic ceramics, optic lithium niobate
crystal, engineering plastic enhancement, functional plastic
film, broaching light-guide fiber, dental materials, cosmetic and
chemical, pharmaceuticals and environmental protection. It is
obvious that spherical silica powder has to be the most important
basic material in the high technology area.