Two-component encapsulating system based on epoxy By Qinglongda (Shanxi) Technology of New Material Co., Ltd,

Two-component encapsulating system based on epoxy

离岸价格

获取最新报价

( Negotiable )

10 Box Minimum Order

国家:

China

型号:

离岸价格:

( Negotiable )（面議）获取最新报价

位置:

Jincheng, Shanxi, China

最小订单价格:

最小订单:

10 Box

包装细节:

交货时间:

55 days

供应能力:

10000 Box per Week

付款方式:

T/T

產品組 :

Electronic encapsulants

产品规格

Classification: Double Components Adhesives
Main Raw Material: Epoxy
Usage: Construction
Brand Name: QLD

详情

Two-component encapsulating system based on epoxy

**4 epoxy potting is a class of two-component, self-leveling, room temperature curing epoxy resin potting material, with excellent aging resistance, moisture resistance, electrical insulation, high hardness and high breakdown voltage. It is suitable for all kinds of pouring bonding and sealing of electronic components.
Product Details
QLD**4T transparent potting compound
It is suitable for room temperature potting of digital tubes
QLD**4P General Purpose Encapsulant
It is used for potting of general electronic components and circuit board closure protection
QLD**4L low viscosity encapsulant
It is suitable for potting circuit boards with high flow requirements
QLD**4D thermally conductive flame retardant potting compound
It is suitable for potting protection of modules and circuit boards with high requirements for heat dissipation and flame retardancy
QLD**4HTR High Temperature Resistant Encapsulant
It is suitable for bonding, sealing and potting parts under high temperature conditions
Product performance

Performance		**4T	**4P	**4L		**4D	**4HTR
Before curing	Color	Clear liquids	Black / Brown	Black / Brown		Black / Brown	Black / Clear
	Viscosity （Pa.S, A/B）	4/0.7	*8/0.1	*2/0.1		*8/0.1	*5/0.1
	Density （g/cm3, A/B）	1.1/1.0	1.6/1.1	1.5/1.1		1.8/1..1	1.8/1.1
Mixing ratio, weight-%（A∶B）		2∶1	5∶1	5∶1		5∶1	5∶1
Pot life（min）		*0	*0	*0		*0	*0
Complete chemical curing（h）		*8	*8	*8		*8	*8
After curing	Shore-D-hardness（S.D）	≥*0	≥*0	≥*0		≥*0	≥*0
	Curing shrinkage (%)	0.8	0.5	0.5		0.5	0.5
	Thermal conductivity (W/M·K)	0.3	0.3	0.3		0.7	0.7
	Burning behaviour（UL*4）	HB	V0	HB		V0	V0
	Dielectric strength（kV/mm）	≥*5
	Volume resistance（Ω·cm）	1.2×***4
	Temperature range of use(℃)	*0~0			0~0

Operational process

Clean up the potting place, no oil, no water, no debris.
Stir the A component evenly, weigh the A component and the B component according to the ratio, put it into the mixing tank, fully stir and mix evenly, it is best to vacuum and deaeration for about *0 minutes, and the amount of glue should not exceed 1/2 of the container, otherwise the glue will overflow during degassing.
Pour the mixed rubber into the product that needs to be potted as soon as possible.
The potted workpiece is cured at room temperature, and it takes 1~2 days to completely cure. In summer, the temperature is high, and the curing will be faster; The temperature is low in winter, the curing will be slower, and it can be assembled after 2~3 hours at *0°C.

Precautions

If there is precipitation or stratification of component A, it should be stirred evenly and used without affecting the performance of the product.
The mixed glue should be used up at one time, and the unused rubber and curing agent should be sealed and stored.
Sealed and stored in a cool and dry place for six months.
Packing specifications: *0kg/set for **4T, *2kg/set for others.

国家:	China
型号:	-
离岸价格:	( Negotiable ) （面議）获取最新报价
位置:	Jincheng, Shanxi, China
最小订单价格:	-
最小订单:	10 Box
包装细节:	-
交货时间:	55 days
供应能力:	10000 Box per Week
付款方式:	T/T
產品組 :	Electronic encapsulants