Sireda Technology Co, Ltd

provide customized ic test and burn in socket for all kinds of IC pitch:0.35-1.27mm size:different package:BGA, LGA, QFN, QFP, SOP, MCM, POP, BGA162/1

Sireda Technology supply high quality & stable performance DDR SDRAM testing solution. Use strong abrasive resistance GCR as contact, reduce the tran

is_customized:Yes Brand Name:SIREDA Model Number:702-0000003 Package:BGA Pitch:0.5mm Pin Count:162/168 IC Size:12X13.5mm Structure:Clamshell Contact

is_customized:Yes Brand Name:SIREDA Model Number:702-0000058 Package:BGA Pitch:0.5mm Pin Count:153 IC Size:11.5X13mm Structure:Clamshell Contact:Sprin

TheTEST FIXTUREis designed for test, debug, validation, and programming of eMMC, eMCP, RF, CPU, etc.

703-0000089_BGA169(eMMC) Socket USB Solution_14X18mm TheUSB solutionis designed for test, debug, validation, and programming of eMMC, eMCP devices Th

703-0000092_BGA162(eMCP) Socket USB Solutions_12X16mm TheUSB solutionis designed for test, debug, validation, and programming of eMMC, eMCP devices

Item specifics Package:BGA Pitch:0.5mm Pin Count:221 IC Size:11.5X13mm Structure:Clamshell Contact:Spring Probe Product Description BGA153 S

Torlon is used as socket body material, apply Aluminum Alloy to socket lid. make the socket durable. QFP44 socket lid Pogo pin contact, life cycle