Shenzheng Xinweite Silicone Material Co., Ltd

This type of adhesive tape possesses ultimate bonding strength with low thermal impedance, with which in effect can be able to replace the method of l

thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base

This type of adhesive tape possesses ultimate bonding strength with low thermal impedance, with which in effect can be able to replace the method of l

Application: Applied to the chip, flexible circuit boards and high-power transistors and heat sinks or other cooling device bonding

thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base

This type of adhesive tape possesses ultimate bonding strength with low thermal impedance, with which in effect can be able to replace the method of l

thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base

This type of adhesive tape possesses ultimate bonding strength with low thermal impedance, with which in effect can be able to replace the method of l

This type of adhesive tape possesses ultimate bonding strength with low thermal impedance, with which in effect can be able to replace the method of l

thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base