详情
is_customized:Yes
Brand Name:SIREDA
Model Number:**********8
Package:BGA
Pitch:0.5mm
Pin Count:**3
IC Size:*1.5X*3mm
Structure:Clamshell
Contact:Spring Probe
BGA**3(eMMC) Socket SD Solution_*1.5X*3mm Premium
The SD solution is designed for test, debug, validation, and
programming of eMMC, eMCP devices
The SD solution provides a compact test solution for eMMC, eMCP
devices used in applications such as handheld, mobile, and TV
product development.
Test, debug, validation, and programming of eMMC, eMCP
devices
Failure analysis / System and wafer test
Package and Chip qualification
Production prototype / Data recover
Suitable for devices of Samsung, Hynix, Sandisk, Toshiba,
Intel, Kingston etc eMMC and eMCP. Support eMMC version:
≤eMMC5.0. Support hot plug, eMMC can be directly connected to PC
with SD card reader. Realize reading, accessing and writting data
for eMMC and eMCP devices
Mechanical
Socket Body: PPS
Socket Lid: Aluminum Alloy
Contact: Spring Probe
Operation Temperature: 0ºC to *0ºC
Life Span at Operating Travel:*0K min.
Cycles Spring Force:*4.5g per Pin
Electrical
Current Rating (Continuous) : 2A
DC Resistance: **0mohm
Place a Device by hand on to the socket. Lock the lid. Connect to
PC by SD Card Reader. Now it is ready for use.
Unit Type: piece Package Weight: 0.**0kg (0.*1lb.) Package Size:
*2cm x *1cm x 9cm (4.*2in x 4.*3in x 3.*4in)
国家: |
China |
型号: |
-
|
离岸价格: |
455 / Piece (面議)
获取最新报价
|
位置: |
- |
最小订单价格: |
455 per Piece |
最小订单: |
1 Piece |
包装细节: |
- |
交货时间: |
3-7 days |
供应能力: |
- |
付款方式: |
Other, PayPal, Western Union, L/C, T/T |
產品組 : |
SD solution
|