Benefits
• Allows testing of RF devices at the wafer-level
• Adaptable to wafer-level probing and singulated device testing for debug and characterization
• Long life and extended maintenance intervals
• Engineering analysis of WLCSP devices or KGD
• Consistently high test yields
• Maximum mechanical operating window to overcome z-stack non-coplanarity
Key Features
• Low loop inductance and high bandwidth
• Device pitches down to **0 µm
• Variety of contact and body materials to optimize performance
• Manual actuation of singulated devices • Low and stable contact resistance
• Individual probe compliance with large mechanical overdrive
| 国家: | China |
| 型号: | - |
| 离岸价格: | ( Negotiable ) 获取最新报价 |
| 位置: | - |
| 最小订单价格: | - |
| 最小订单: | 1 Unit |
| 包装细节: | WLCSP |
| 交货时间: | 15days |
| 供应能力: | - |
| 付款方式: | T/T |
| 產品組 : | - |
